Noctua NT-H1 Thermal Compound

Noctua NT-H1 Thermal Compound is a premium thermal interface material designed for reliable, long‑lasting heat transfer between the CPU heat spreader and the cooling solution. The classic 3.5 g syringe packaging is crafted for precise, easy application and multiple re‑applications as needed over time.

• 3.5g syringe packaging provides enough material for around 3–20 applications depending on CPU size.
• Not electrically conductive and safe to use with copper, aluminum, and other common cooler materials.
• Non-corroding and designed for long‑term reliability in a variety of conditions.
• Excellent long‑term stability: can be stored at room temperature for years and used on the CPU for many years after application.
• Wide operating temperature range from -50°C to +110°C, suitable for both standard desktops and more demanding cooling scenarios.
• Easy spreading and cleanup with a formulation that spreads smoothly and remains manageable during installation and after removal.

Since its introduction, NT-H1 has been a trusted benchmark among PC builders and reviewers for delivering stable, dependable performance across countless systems. Independent tests and reviews commonly highlight its solid real‑world performance in a broad range of cooling setups.